All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.

SPECIFICATIONS

DDRIII SO DIMM Socket

Mechanical

Contact Retention Force: 0.10kg min.

Durability : 60 Cycles

Electrical

Voltage Rating: 25V

Current Rating: 0.5A

Contact Resistance: 50m

Ω max.

Dielectric Withstanding Voltage: 250V AC/1 min.

Insulation Resistance: 100M

Ω

Physical

Housing: Thermoplastic, UL 94V-0 rated in Ivory Color

Contact: Copper alloy

Plating: See “ORDERING INFORMATION”

Metal Spring: Copper alloy

Operating Temperature: -55℃

℃

℃

℃ to +85℃

℃

℃

℃

AS S eries

5.2mm Height SM T Typ e

0.60mm Pitch

204 P os.

DRAWING

DIM. B

1.3 5

6 9 .6

6 8 .0 0

6 3 .7

7 1.3

3 3 .4 0

6 6 .8 0

POS.NO. 1

POS.NO. 2 0 3

POS.NO. 2 0 4

POS.NO. 2

3 .0 0

3 .0 0

DIM. A

DIM. B

DIM. A

DIM. B

6 6 .8 0

3 .5 0

0 .6 0

DIM. A

1.6 5

DIM. B

5 .2

POS.NO. 2

POS.NO. 1

POS.NO. 2 0 3

POS.NO. 2 0 4

0 .6 0

REC OMMEDED P.C .B LA YOUT

6 2 .10

1.3 5

1,6 5

DIM. A

1.6 0

1.10

ORDERING

I N F O R M AT I O N

H=HALOGEN

/LEAD FREE

6=Normal Type

S=Standard

R=Reverse

2=5.2mm Height

H=DDR SODIMM

Memory Module Socket

Horizontal Type

Single Row

SMT Type

A S 0 A6 2 * - H 2 * 6 - * H

Package Code

4=Soft Tray

7=Tape Reel

No. Of Pos.

A6=204 Pos.

Contact Area Plating

1=Gold Flash

Y=5u"Gold Plating

6=10u"Gold Plating

7=15u"Gold Plating

3=30u"Gold Plating

PRODUCT NO.:

A S0 A 6 2 * - H2 S6 - * H

A S0 A 6 2 * - H2 R6 - * H

P/ N

2 1.0 0

3 9 .0 0

2 1.0 0

3 9 .0 0

DIM.A

DIM.B