THERMAL DATA

Symbol

Parameter

DIP16+2+2

PowerSO20

Unit

Thermal Resistance, Junction to Pin

12

–

°C/W

Thermal Resistance, Junction to Ambient

(see Thermal Characteristics)

40

–

°C/W

Thermal Resistance, Junction to Ambient (see Thermal

Characteristics)

50

–

°C/W

Thermal Resistance Junction-case

–1.5

°C/W

Figure 1: Printed Heatsink

THERMAL CHARACTERISTICS

DIP16+2+2. The thermal resistance is referred to

the thermal path from the dissipating region on

the top surface of the silicon chip, to the points

along the four central pins of the package, at a

distance of 1.5 mm away from the stand-offs.

If a dissipating surface, thick at least 35

µm, and

with a surface similar or bigger than the one

shown, is created making use of the printed cir-

cuit.

Such heatsinking surface is considered on the

bottom side of an horizontal PCB (worst case).

If the power dissipating pins (the four central

ones), as well as the others, have a minimum

thermal connection with the external world (very

thin strips only) so that the dissipation takes place

through still air and through the PCB itself.

It is the same situation of point above, without any

heatsinking surface created on purpose on the

board.

Additional data on the PowerDip and the

PowerSO20 package can be found in:

Application Note AN467:

Thermal Characteristics of the PowerDip

20,24 Packages Soldered on 1,2,3 oz.

Copper PCB

Application Note AN668:

A New High Power IC Surface Mount Package:

PowerSO20 Power IC Packaging from Insertion

to Surface Mounting.

L6234

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