HUM2015SM datasheet(2/221 Pages) MICROCHIP

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products)

Packing Method

(For CSAC and RFDS

products)

Refer to Pre and Post Change summary for complete details

Part Aging Policy

(For CSAC products only)

No Part Expiration

Use MCHP Spec

For more information related to

Microchip’s part aging strategy,

please visit the following link on our

website: Component Age Policy

Part Aging Policy and

Recertification

(For RFDS products only)

No Part Expiration

Use MCHP spec

Re-life / certification performed as a line

item per customer request.

For more information related to

Microchip’s part aging strategy,

please visit the following link on our

website: Component Age Policy

Use Microsemi Spec

When requested:

Lot Sample:

Final Electrical Test

QA Visual

Inspection Date of CofC

Use MCHP Spec

When requested:

Lot Sample:

Final Electrical Test

QA Visual

Inspection Date of CofC

Combination Rules

(For RFDS products only)

Tape & Reel:

Use Microsemi Spec

Multiple Options

1 device / 1 lot / 1 date code

1 device / multiple date codes

and production lots

Tape & Reel:

Some custom, others can follow MCHP spec

1 Device

3 Date codes

No limit to number of production lots

follow date code combination rule

1 Assembly Site

HUM2015SM 数据表(PDF) 2 Page - Microchip Technology

HUM2015SM 数据表(HTML) 2 Page - Microchip Technology

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