4

AM26LS31, AM26LS31C, AM26LS31I, AM26LS31M

SLLS114L – JANUARY 1979 – REVISED OCTOBER 2018

www.ti.com

Product Folder Links: AM26LS31 AM26LS31M

Submit Documentation Feedback

Copyright © 1979–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential output voltage VOD, are with respect to network GND.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage(2)

7

V

VI

Input voltage

7

V

Output off-state voltage

5.5

V

Lead temperature 1,6 mm (1/16 in) from case for 10 s

260

°C

Lead temperature 1,6 mm (1/16 in) from case for 60 s J package

300

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VCC

Supply voltage

AM26LS31C

4.75

5

5.25

V

AM26LS31M

4.5

5

5.5

VIH

High-level input voltage

2

V

VIL

Low-level input voltage

0.8

V

IOH

High-level output current

–20

mA

IOL

Low-level output current

20

mA

TA

Operating free-air temperature

AM26LS31C

0

70

°C

AM26LS31I

–40

85

AM26LS31M

–55

125

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

6.4 Thermal Information

THERMAL METRIC(1)

AM26LS31x

UNIT

D (SOIC)

DB (SSOP)

N (PDIP)

NS (SO)

16 PINS

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance(2)

73

82

67

64

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

38.1

–

–

32.6

°C/W

RθJB

Junction-to-board thermal resistance

34.7

–

–

36.8

°C/W

ψJT

Junction-to-top characterization parameter

7.1

–

–

4.2

°C/W

ψJB

Junction-to-board characterization parameter

34.4

–

–

36.5

°C/W