November 1992

9

Philips Semiconductors

Product specification

UHF power MOS transistor

BLF521

Fig.12 Component layout for 500 MHz test circuit.

The circuit and components are situated on one side of the printed circuit board, the other side being fully

metallized, to serve as a ground plane. Earth connections are made by means of copper straps and hollow rivets

for a direct contact between upper and lower sheets.

handbook, full pagewidth

MBA381

+VDS

R4

L1

C1

C2

L2

C3

L3

C4

R3

C7

R2

C5

R1

L4

L5

C8

R6

L7

C9

C10

C11

C13

C12

L10

C14

C15

L8

C6

L9

L6

handbook, full pagewidth

MBA380

150 mm

70

mm

strap

rivets

rivets

rivets

strap

strap

strap

mounting

screws

(6x)