Preliminary Technical Data

AD7980

Rev Pr C | Page 21 of 22

OUTLINE DIMENSIONS

0.23

0.08

0.80

0.60

0.40

8°

0°

0.15

0.00

0.27

0.17

0.95

0.85

0.75

SEATING

PLANE

1.10 MAX

10

6

5

1

0.50 BSC

3.00 BSC

3.00 BSC

4.90 BSC

PIN 1

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-187-BA

Figure 29.10-Lead Mini Small Outline Package [MSOP]

(RM-10)

Dimensions shown in millimeters

3.00

BSC SQ

INDEX

AREA

TOP VIEW

1.50

BCS SQ

EXPOSED

PAD

(BOTTOM VIEW)

1.74

1.64

1.49

2.48

2.38

2.23

1

6

10

0.50

BSC

0.50

0.40

0.30

5

PIN 1

INDICATOR

0.80

0.75

0.70

0.05 MAX

0.02 NOM

SEATING

PLANE

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.55 TYP

SIDE VIEW

PADDLE CONNECTED TO GND.

THIS CONNECTION IS NOT

REQUIRED TO MEET THE

ELECTRICAL PERFORMANCES

Figure 30. 10-Lead Lead Frame Chip Scale Package [QFN (LFCSP_WD)]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-10-9)

Dimensions shown in millimeters