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AD9640/PCB 数据表(PDF) 9 Page - Analog Devices |
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AD9640/PCB 数据表(HTML) 9 Page - Analog Devices |
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9 / 41 page ![]() Preliminary Technical Data AD9640 Rev. PrD | Page 9 of 41 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating ELECTRICAL AVDD, DVDD to AGND −0.3 V to +2.0 V DRVDD to DRGND −0.3 V to +3.9 V AGND to DRGND −0.3 V to +0.3 V VIN+A/B, VIN-A/B to AGND −0.3 V to AVDD + 0.2 V CSB to AGND −0.3 V to +3.9V D0A/B through D13A/B to DRGND −0.3 V to DRVDD + 0.3 V FD0A/B through FD3A/B to DRGND −0.3 V to DRVDD + 0.3 V DCOA/B to DRGND −0.3 V to DRVDD + 0.3 V VREF to AGND −0.3 V to AVDD + 0.3 V SENSE to AGND −0.3 V to AVDD + 0.2 V ENVIRONMENTAL Operating Temperature Range (Ambient) −40°C to +85°C Maximum Junction Temperature Under Bias 150°C Storage Temperature Range (Ambient) −65°C to +150°C Stresses above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL CHARACTERISTICS The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 6. Thermal Resistance Package Type θJA θJC Unit 64 lead LFCSP 9 mm sq. (CP-64-3) 24 TBD °C/W Typical θJA and θJC are specified for a 4-layer board in still air. Airflow increases heat dissipation effectively reducing θJA. In addition, metal in direct contact with the package leads from metal traces, and through holes, ground, and power planes, reduces the θJA. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
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