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CS5159 数据表(PDF) 13 Page - ON Semiconductor |
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CS5159 数据表(HTML) 13 Page - ON Semiconductor |
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13 / 16 page ![]() CS5159 http://onsemi.com 13 A heatsink may be added to TO−220 components to reduce their thermal impedance. A number of PC board layout techniques such as thermal vias and additional copper foil area can be used to improve the power handling capability of surface mount components. EMI Management As a consequence of large currents being turned on and off at high frequency, switching regulators generate noise as a consequence of their normal operation. When designing for compliance with EMI/EMC regulations, additional components may be added to reduce noise emissions. These components are not required for regulator operation and experimental results may allow them to be eliminated. The input filter inductor may not be required because bulk filter and bypass capacitors, as well as other loads located on the board will tend to reduce regulator di/dt effects on the circuit board and input power supply. Placement of the power component to minimize routing distance will also help to reduce emissions. Figure 20. Filter Components 1000 pF 33 Ω 2.0 μH Figure 21. Input Filter 1200 pF × 3.0/16 V 2.0 μH + Layout Guidelines 1. Place 12 V filter capacitor next to the IC and connect capacitor ground to pin 11 (PGND). 2. Connect pin 11 (PGND) with a separate trace to the ground terminals of the 5.0 V input capacitors. 3. Place fast feedback filter capacitor next to pin 8 (VFFB) and connect it’s ground terminal with a separate, wide trace directly to pin 14 (LGND). 4. Connect the ground terminals of the Compensation capacitor directly to the ground of the fast feedback filter capacitor to prevent common mode noise from effecting the PWM comparator. 5. Place the output filter capacitor(s) as close to the load as possible and connect the ground terminal to pin 14 (LGND). 6. Connect the VFBpin directly to the load with a separate trace (remote sense). 7. Place 5.0 V input capacitors close to the switching MOSFET and synchronous MOSFET. Route gate drive signals VGATE(H) (pin 10) and VGATE(L) (pin 12 when used) with traces that are a minimum of 0.025 inches wide. Figure 22. Layout Guidelines To the negative terminal of the output capacitors VCC 100 pF 0.1 μF SOFT START OFF TIME VCOMP To the negative terminal of the input capacitors 15 11 5 8 VFFB 1.0 μF |
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