CS5308 datasheet(3/31 Pages) ONSEMI

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CS5308

http://onsemi.com

MAXIMUM RATINGS*

Rating

Value

Unit

Operating Junction Temperature

150

°C

Lead Temperature Soldering:

Reflow: (SMD styles only) (Note 1)

230 peak

°C

Storage Temperature Range

−65 to 150

°C

Package Thermal Resistance

Junction−to−Case, RqJC

Junction−to−Ambient, RqJA

°C/W

ESD Susceptibility (Human Body Model)

2.0

JEDEC Moisture Sensitivity

Level 2

−

1. 60 second maximum above 183°C.

*The maximum package power dissipation must be observed.

MAXIMUM RATINGS

Pin Name

VMAX

VMIN

ISOURCE

ISINK

COMP

6.0 V

−0.3 V

1.0 mA

VFB

6.0 V

−0.3 V

1.0 mA

VDRP

6.0 V

−0.3 V

1.0 mA

CS1−CS2

6.0 V

−0.3 V

1.0 mA

CSREF

6.0 V

−0.3 V

1.0 mA

PWRGD

6.0 V

−0.3 V

1.0 mA

8.0 mA

VID Pins

6.0 V

−0.3 V

1.0 mA

ILIM

6.0 V

−0.3 V

1.0 mA

REF

6.0 V

−0.3 V

1.0 mA

20 mA

VTT

6.0 V

−0.3 V

1.0 mA

VTTCT

6.0 V

−0.3 V

1.0 mA

40 mA

VTTPGD

6.0 V

−0.3 V

1.0 mA

8.0 mA

VCCHx

20 V

−0.3 V

N/A

1.5 A for 1.0 ms,

200 mA DC

GATE(H)x

20 V

−0.3 V DC

−2.0 V for 100 ns

1.5 A for 1.0 ms,

200 mA DC

1.5 A for 1.0 ms,

200 mA DC

GATE(L)x

16 V

−0.3 V DC

−2.0 V for 100 ns

1.5 A for 1.0 ms,

200 mA DC

1.5 A for 1.0 ms,

200 mA DC

VCCL12

16 V

−0.3 V

N/A

1.5 A for 1.0 ms,

200 mA DC

PGND

0.3 V

−0.3 V

2.0 A, 1.0 ms, 200 mA DC

N/A

LGND

0 V

50 mA

N/A

VCCL

16 V

−0.3 V

N/A

50 mA

ROSC

6.0 V

−0.3 V

1.0 mA

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