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NCV7708 数据表(PDF) 13 Page - ON Semiconductor |
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NCV7708 数据表(HTML) 13 Page - ON Semiconductor |
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13 / 16 page ![]() NCV7708 http://onsemi.com 13 Various copper areas used for heat spreading Active Area (red) Lead #1 Lead #8 (one of 8 thermal leads) Thermal Model Package Construction With and Without Mold Compound Molded as 1/4 Symmetry Figure 8. qJA vs. Copper Spreader Area COPPER AREA (mm2) 1000 300 200 100 0 40 50 60 70 80 90 110 400 700 600 500 800 900 100 1 oz 2 oz 100 10 1.0 0.1 0.01 TIME (sec) 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 Cu_Area = 239 mm2 1 oz Figure 9. SOIC 28−Lead Single Pulse Heating Curve Cu_Area = 986 mm2 1 oz 1 S |
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