AD8134

Rev. A | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

12 V

Power Dissipation

See Figure 3

Input Common-Mode Voltage

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

specified for the device soldered in a circuit board in still air.

Table 4. Thermal Resistance with the Underside Pad

Thermally Connected to a Copper Plane

Package Type/PCB Type

Unit

24-Lead LFCSP/4-Layer

70

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the AD8134 package is

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the AD8134. Exceeding a junction temperature

of 175°C for an extended period can result in changes in the

silicon devices potentially causing failure.

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

and common-mode currents flowing to the loads, as well as

currents flowing through the internal differential and common-

mode feedback loops. The internal resistor tap used in the

common-mode feedback loop places a 4 kΩ differential load on

the output. RMS output voltages should be considered when

dealing with ac signals.

with the package leads from metal traces, through holes,

the underside of the package must be soldered to a pad on the

PCB surface that is thermally connected to a PCB plane to

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 24-lead LFCSP

(70°C/W) on a JEDEC standard 4-layer board with the

underside paddle soldered to a pad that is thermally connected

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

–40

–20

0

20

40

60

LFCSP

80

AMBIENT TEMPERATURE (

°C)

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.