AD8224ACPZ-R7 datasheet(9/27 Pages) AD

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Preliminary Technical Data

AD8224

ABSOLUTE MAXIMUM RATINGS

Maximum Power Dissipation

The maximum safe power dissipation for the AD8224 is limited

by the associated rise in junction temperature (TJ) on the die. At

approximately 130°C, which is the glass transition temperature,

the plastic changes its properties. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the amplifiers. Exceeding a temperature of 130°C for an

extended period can result in a loss of functionality.

Figure 2 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the LFCSP on a 4-layer

JEDEC standard board.

4.0

3.5

3.0

θJA = 48°C/W WHEN THERMAL PAD

IS SOLDERED TO BOARD

θJA = 86°C/W WHEN THERMAL PAD

IS NOT SOLDERED TO BOARD

2.5

2.0

1.5

Table 8.

Parameter

Supply Voltage

±18 V

Power Dissipation

See Figure 2

Output Short Circuit Current

Indefinite1

Input Voltage (Common Mode)

±Vs

Differential Input Voltage

±Vs

Storage Temperature

−65°C to +130°C

Operating Temperature Range2

−40°C to +125°C

Lead Temperature Range (Soldering 10 sec)

300°C

Junction Temperature

130°C

Package Glass Transition Temperature

130°C

ESD (Human Body Model)

4 kV

ESD (Charge Device Model)

1 kV

ESD (Machine Model)

0.4 kV

1Assumes the load is referenced to mid-supply.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

1.0

maximum rating conditions may affect device reliability.

0.5

THERMAL RESISTANCE

Rating

2Temperature for specified performance is −40°C to +85°C. For performance

to +125°C, see the Typical Performance Characteristics section.

Table 9.

–60

–40

–20

100

120

140

Thermal Pad

θJA

Unit

Soldered to Board

°C/W

Not Soldered to Board

°C/W

AMBIENT TEMPERATURE (°C)

Figure 2. Maximum Power Dissipation

ESD CAUTION

The θJA values in Table 9 assume a 4-layer JEDEC standard

board. If the thermal pad is soldered to the board, then it is

also assumed it is connected to a plane. θJC at the exposed pad

is 4.4°C/W.

Rev. PrB | Page 9 of 27

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