ADA4411-3

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (V

Supply Voltage

12 V

Power Dissipation

See Figure 2

S

) times the

quiescent current (I

Storage Temperature

–65°C to +125°C

S

). The power dissipated due to load drive

depends on the particular application. For each output, the

power due to load drive is calculated by multiplying the load

current by the associated voltage drop across the device. The

power dissipated due to all of the loads is equal to the sum of

the power dissipations due to each individual load. RMS

voltages and currents must be used in these calculations.

Operating Temperature Range

–40°C to +85°C

Lead Temperature Range (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

In addition, more metal directly in contact with the package

leads from metal traces, through-holes, ground, and power

planes reduces the θ .

JA

THERMAL RESISTANCE

Figure 2 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 24-lead QSOP

(83°C/W) on a JEDEC standard 4-layer board. θ

θ is specified for the worst-case conditions, that is, θ

JA

JA

is

specified for device soldered in circuit board for surface-mount

packages.

JA

values are

approximations.

Table 4. Thermal Resistance

AMBIENT TEMPERATURE (

°C)

–40

–20

0

20

40

60

0.5

0.7

0.9

1.1

1.3

1.5

1.7

1.9

2.1

2.3

2.5

80

Package Type

θ

Unit

JA

24 Lead QSOP

83

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the ADA4411-3

package is limited by the associated rise in junction temperature

transition temperature, the plastic changes its properties.

Even temporarily exceeding this temperature limit may change

the stresses that the package exerts on the die, permanently

shifting the parametric performance of the ADA4411-3.

Exceeding a junction temperature of 150°C for an extended

period can result in changes in the silicon devices potentially

causing failure.

Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.