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ADA4430-1YKSZ-R7 数据表(PDF) 4 Page - Analog Devices

部件名 ADA4430-1YKSZ-R7
功能描述  Ultralow Power Video Filter with Power-Down
PDF  16 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADA4430-1YKSZ-R7 数据表(HTML) 4 Page - Analog Devices

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ADA4430-1
Rev. A | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
6 V
Power Dissipation
See Figure 3
Storage Temperature Range
–65°C to +125°C
Operating Temperature Range
–40°C to +125°C
Lead Temperature (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for a device soldered in the circuit board.
Table 4. Thermal Resistance
Package Type
θJA
Unit
6-Lead SC70
430
°C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4430-1
package is limited by the associated rise in junction temperature
(TJ) on the die. At approximately 150°C, which is the glass
transition temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit can change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the ADA4430-1. Exceeding a
junction temperature of 150°C for an extended period can
result in changes in the silicon devices potentially causing
failure.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the
voltage between the supply pins (VS) times the quiescent
current (IS). The power dissipated due to the load drive depends
upon the particular application. The power due to load drive is
calculated by multiplying the load current by the associated
voltage drop across the device. RMS voltages and currents must
be used in these calculations.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through-holes, ground, and power planes
reduces the θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 6-lead SC70
(430°C/W) on a JEDEC standard 4-layer board.
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
–40
120
100
80
60
40
020
–20
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.



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