ADA4310-1

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

10-Lead MINI_SO_EP

12 V

16-Lead LFCSP_VQ

±6V

Power Dissipation

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

specified for device soldered in circuit board for surface-mount

packages.

Table 3.

Package Type

Unit

10-Lead MINI_SO_EP

44

°C/W

16-Lead LFCSP_VQ

63

°C/W

Maximum Power Dissipation

The maximum safe power dissipation for the ADA4310-1 is

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the amplifiers. Exceeding a junction temperature of

150°C for an extended period can result in changes in silicon

devices, potentially causing degradation or loss of functionality.

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 10-lead

MINI_SO_EP (44°C/W) and for the 16-lead LFCSP_VQ

approximations.

AMBIENT TEMPERATURE (°C)

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

–35

–15

5

25

45

65

85

LFCSP_VQ-16

MINI_SO_EP-10

Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate

on the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.