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BLF369 数据表(PDF) 2 Page - NXP Semiconductors

部件名 BLF369
功能描述  VHF power LDMOS transistor
PDF  13 Pages
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制造商  PHILIPS [NXP Semiconductors]
网页  http://www.nxp.com
标志 PHILIPS - NXP Semiconductors

BLF369 数据表(HTML) 2 Page - NXP Semiconductors

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BLF369_2
© NXP B.V. 2006. All rights reserved.
Objective data sheet
Rev. 02 — 8 December 2006
2 of 13
NXP Semiconductors
BLF369
VHF power LDMOS transistor
2.
Pinning information
[1]
Connected to flange.
3.
Ordering information
4.
Limiting values
5.
Thermal characteristics
[1]
Tj is the junction temperature.
[2]
Rth(j-case) and Rth(j-h) are measured under RF conditions.
[3]
Rth(j-h) is dependent on the applied thermal compound and clamping/mounting of the device.
Table 2.
Pinning
Pin
Description
Simplified outline
Symbol
1
drain1
2
drain2
3
gate1
4
gate2
5
source
[1]
5
12
4
3
4
3
5
1
2
sym117
Table 3.
Ordering information
Type number
Package
Name
Description
Version
BLF369
-
flanged LDMOST ceramic package; 2 mounting holes;
4 leads
SOT800-2
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
-
65
V
VGS
gate-source voltage
−0.5
+13
V
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
200
°C
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-case)
thermal resistance from junction to case
Tj = 200 °C
[1][2] 0.26
K/W
Rth(j-h)
thermal resistance from junction to heatsink Tj = 200 °C
[1][2][3] 0.35
K/W



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