µ PC29xx Series

19

Data Sheet G10026EJ4V0DS

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering

processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our

sales offices.

For more details, refer to the Semiconductor Device Mount Manual

(http://www.necel.com/pkg/en/mount/index.html)

Surface mount devices

µPC29xxT Series: SC-63 (MP-3Z)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 235

°C or below (Package surface temperature),

IR35-00-3

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 3 times or less.

VPS

Peak temperature: 215

°C or below (Package surface temperature),

VP15-00-3

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 3 times or less.

Partial heating method

Pin temperature: 350

°C or below,

P350

Heat time: 3 seconds or less (Per each side of the device).

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the

device will be damaged by heat stress.

Remark Flux: Rosin-based flux sith low chlorine content (chlorine 0.2 Wt% or below) is recommended.

µPC29xxT-AZ Series Note1, µPC29xxT-AY Series Note2: SC-63 (MP-3Z)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 260

°C or below (Package surface temperature),

IR60-00-3

Reflow time: 60 seconds or less (at 220

°C or higher),

Maximum number of reflow processes: 3 times or less.

Partial heating method

Pin temperature: 350

°C or below,

P350

Heat time: 3 seconds or less (Per each side of the device).

Notes 1. Pb-free (This product does not contain Pb in the external electrode.)

2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the

device will be damaged by heat stress.

Remark Flux: Rosin-based flux sith low chlorine content (chlorine 0.2 Wt% or below) is recommended.

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