Data Sheet

G15377EJ4V0DS

7

µPC4084

RECOMMENDED SOLDERING CONDITIONS

The

µPC4084 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Type of Through-hole Device

µPC4084C: 14-pin plastic DIP (7.62 mm (300))

Process

Conditions

Wave Soldering

(only to leads)

Solder temperature: 260°C or below,

Flow time: 10 seconds or less.

Partial Heating Method

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (per each lead).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that

the package body does not get jet soldered.