More Innovation. Less Heat.

Units 1-2 Cosford Business Park, Central Park, Lutterworth, Leicestershire, LE17 4QU, United Kingdom

T +44 (0)1455 553 510

E sales@tglobaltechnology.com

W www.tglobaltechnology.com

Version18

20220628

T-Global Technology (Europe & North America) Limited

NOTICE: The information contained herein is to the best of our knowledge true and accurate. Values stated in this technical data sheet represent typical values as not all tests are run on each lot of material

produced. All specifications are subject to change without notice. The protective film and release paper does not affect the function of the product. If there is no special requirement, the default depends on

T-Global. Since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their

own test to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this

product shall be of standard quality, and except to the extent otherwise stated in T-Global Technology’s invoice, quotation, or order acknowledgment.

We disclaim any and all liabilities incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be

construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.

T-Global Technology are proud to announce

the launch of a new company logo and mission

statement as part of the ongoing growth and

evolution of our company’s brand.

(old version)

2

Features

Applications

Best for high power applications

Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile

Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED,

Mother Board,Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device,

Wireless Hub, DDR ll Module, etc.

• Horizontallyconduction

• Passivecomponents

• Highstability

• Efficiencyhigherthanheatpipe10times

Vapor Chamber

Properties

Exchange with Ex

ternal Heat 

Exchange with Ex

ternal Heat 

Mechanism

▶Differentindustrieswillrequiredifferentspecifications,pleasecontactusdireclyforthemostsuitablespecifications.

Item

VC001

VC002

VC003

XVC-A001

XVC-A002

Unit Tolerance

Size

56

×56

106

×70

106

×70

90

×60

80

×80

mm

±0.3

Thickness

3.0

3.0

25.5

0.4

0.4

mm

±0.05

Thermal Resistance

≦0.21

≦0.16

≦0.16

<0.02

<0.02

°C/W

-

Material

Pure copper

Copper alloy

-

-

Surface finishing

anti-oxidation

-

-

Extra components

-

-

copper

heat sink

-

-

-

-

Operation Power (Qmax)

≥

110

≥

150

≥

150

10

10

W

-

Image

-

-