 2019 Microchip Technology Inc.

DS20006084A-page 13

MIC4126/27/28

© 2018 Microchip Technology Incorporated

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Lead Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

c

e

L

E

N

1.27 BSC

0.20

0.41

0.35

1.43

0.00

0.41

0.64

2.41

1.55

0.05

6.02 BSC

MILLIMETERS

MIN

NOM

8

0.89

0.49

1.68

0.10

MAX

L1

1.04 REF

Terminal-to-Exposed-Pad

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Overall Length

Exposed Pad Length

D

D1

4.89 BSC

3.10

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

C

L

(L1)

Molded Package Thickness

A2

1.25

-

-

Foot Angle

Terminal Length

Lead Bend Radius

R1

R2

-

0.07

0°

5°

--

8°

-

5°

15°

Mold Draft Angle

Mold Draft Angle

-

5°

15°

-

0.07

0.25

0.19

Molded Package Width

E1

3.90 BSC

-

-

--

Microchip Technology Drawing C04-1136 Rev A Sheet 2 of 2

8-Lead Small Outline Integrated Circuit Package (EQA) - 3.90 mm (1.50 In) Body [SOIC]

With 3.10x2.41 mm Exposed Pad

C

SEATING

PLANE

DETAIL A

R2

R1