The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

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SOLDER ABILITY

Solderability

95% of immersed area must

show no voids , pin holes

Dip solder tails into the molten

solder(held at 230±5 °C) up to

0.5mm from the tip of tails for 3±0.5

seconds.

(MIL-STD-202 METHOD 208)

Resistance to soldering heat No melting, cracks or functional

damage allowed

All connectors designed for PCB

soldering within this specification must

be able to withstand the heat from

solder oven according to the graph

below. The cycle should be repeated

twice.

(MIL-STD-202 METHOD 210)

Preheating temperature: 150 ~ 200°C, 60~120 seconds

Liquidus temperature (TL): 217°C, 60~150 seconds

Peak temperature: 260°C

Time within 5 °C of peak temperature (Tc): 255°C, 30seconds