 2004 Microchip Technology Inc.

DS21661C-page 9

TCM809/TCM810

3-Lead Plastic Small Outline Transistor (LB) (SC-70)

12˚

8˚

12˚

8˚

b

Mold Draft Angle Bottom

12˚

8˚

12˚

8˚

a

Mold Draft Angle Top

0.40

0.15

.016

.006

B

Lead Width

0.25

0.08

.010

.003

c

Lead Thickness

0.41

0.10

.016

.004

L

Foot Length

2.25

1.80

.089

.071

D

Overall Length

1.35

1.15

.053

.045

E1

Molded Package Width

2.40

1.80

.094

.071

E

Overall Width

.010

0.00

.0004

.000

A1

Standoff

1.00

0.80

.039

.031

A2

Molded Package Thickness

1.10

0.80

.043

.031

A

Overall Height

1.30 BSC.

p1

Outside lead pitch (basic)

0.65 BSC.

p

Pitch

3

3

Number of Pins

MAX

MIN

MAX

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

shall not exceed .005" (0.127mm) per side.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions

Notes:

JEITA (EIAJ) Equivalent: SC70

Drawing No. C04-104

*Controlling Parameter

L

B

E1

E

p

c

p1

D

1

2

3

b

a

A

A2

A1

.026 BSC.

.051 BSC.