Data Sheet S11269EJ1V1DS00

13

µµµµ PD16640C

9. RECOMMENDED MOUNTING CONDITIONS

The following conditions must be met for mounting conditions of the

µPD16640C.

For more details, refer to the Semiconductor Device Mounting Technology Manual(C10535E).

Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under

different conditions.

µ PD16640CN-xxx : TCP(TAB Package)

Mounting Condition

Mounting Method

Condition

Thermocompression

Soldering

Heating tool 300 to 350

°C, heating for 2 to 3 sec ; pressure 100g(per

solder)

ACF

(Adhesive Conductive

Film)

Temporary bonding 70 to 100

°C ; pressure 3 to 8 kg/cm2; time 3 to 5

sec. Real bonding 165 to 180

°C pressure 25 to 45 kg/cm2 time 30 to

40secs(When using the anisotropy conductive film SUMIZAC1003 of

Sumitomo Bakelite,Ltd).

Caution

To find out the detailed conditions for mounting the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more mounting methods at a time.