Package mechanical data

TSV911-TSV912-TSV914

12/18

4

Package mechanical data

In order to meet environmental requirements, STMicroelectronics offers these devices in

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

4.1

SOT23-5 package

DIM.

mm.

mils

MIN.

TYP

MAX.

MIN.

TYP.

MAX.

A

0.90

1.45

35.4

57.1

A1

0.00

0.15

0.0

5.9

A2

0.90

1.30

35.4

51.2

b

0.35

0.50

13.7

19.7

C

0.09

0.20

3.5

7.8

D

2.80

3.00

110.2

118.1

E

2.60

3.00

102.3

118.1

E1

1.50

1.75

59.0

68.8

e

.95

37.4

e1

1.9

74.8

L

0.35

0.55

13.7

21.6

SOT23-5L MECHANICAL DATA

0