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STTH3002C 数据表(PDF) 4 Page - STMicroelectronics |
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STTH3002C 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 11 page ![]() Characteristics STTH3002C 4/11 Figure 3. Forward voltage drop versus forward current (maximum values, per diode) Figure 4. Relative variation of thermal impedance junction to case versus pulse duration 0 10 20 30 40 50 60 70 80 90 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 I(A) FM V(V) FM T =25°C j T =150°C j 0.1 1.0 1.E-03 1.E-02 1.E-01 1.E+00 Z/R th(j-c) th(j-c) Single pulse t(s) p Figure 5. Junction capacitance versus reverse applied voltage (typical values, per diode) Figure 6. Reverse recovery charges versus dIF/dt (typical values, per diode) 10 100 1000 0 50 100 150 200 C(pF) V (V) R F=1MHz V =30mV T =25°C OSC RMS j 0 25 50 75 100 125 150 175 200 225 250 10 100 1000 Q (nC) rr dI /dt(A/µs) F I =15A F V =160V R T =125°C j T =25°C j Figure 7. Reverse recovery time versus dIF/dt (typical values, per diode) Figure 8. Peak reverse recovery current versus dIF/dt (typical values, per diode) 0 10 20 30 40 50 60 70 10 100 1000 t (ns) rr dI /dt(A/µs) F T =25°C j T =125°C j I =15A F V =160V R 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 10 100 1000 I (A) RM dI /dt(A/µs) F T =25°C j T =125°C j I =15A F V =160V R |
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