DA9011.001

28 Jan 2004

2 (9)

PAD LAYOUT

670 µm

MAS

9011

GND

VDD

SOL

PO

LB

DIE size = 0.67 mm x 1.43 mm

PAD size = 80 x 80

µm

Note: Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are

recommended to be performed in ESD protected area.

Note: If the die is to be placed on metal plane, the metal plane should be connected to VDD or left floating. This

because the substrate of the die is internally connected to VDD.

Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die.

Pad Identification

Name

X-coordinate

Y-coordinate

Power Supply Ground

GND

174

µm

1208

µm

Power Supply Voltage

VDD

334

µm

1210

µm

Full Battery Output

SOL

495

µm

1221

µm

Power On Output

PO

211

µm

221

µm

Low Battery Output

LB

462

µm

221

µm