3 (4)

DA6720.000

2 January 2007

PIN DESCRIPTION

Pin Description

Symbol

x-coordinate

y-coordinate

Power Supply Voltage

VDD

141

569

Power Supply for Output Buffer

VDBUFF

141

376

Crystal Oscillator Input

XIN

450

141

Crystal Oscillator Output

XOUT

303

141

Power Supply Ground

VSS

588

379

Buffer Output

OUT

588

594

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component

assembly are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

IC OUTLINES

VD

BUFF

VDD

VSS

XIN

XOUT

OUT

Die Map Reference

730 um

720 um

MAS6720

Figure 2. IC outlines.

Note1: Die map reference is the actual left bottom corner of the sawn chip.

Note2: See coordinates in pin description.

Note3: Die dimensions include 80 µm scribes for both sides.