2 (9)

DA1175.008

13 July, 2006

PIN DESCRIPTION

Pin Description

Symbol

x-coordinate

y-coordinate

Power Supply Voltage

VDD

263

1330

Programming Input

PV

503

1326

Serial Bus Clock Input

CLK

745

1321

Serial Bus Data Input

DA

1001

1321

Temperature Output

TE1

1246

1325

Test Multiplexer Output

TE2

1454

1325

Voltage Control Input

VC

190

231

Crystal Oscillator Output

X1

398

231

Crystal/Varactor Oscillator Input

X2

1355

231

Power Supply Ground

VSS

1828

242

Buffer Output

OUT

2031

231

Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or

left floating. Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are

recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Min

Max

Unit

Note

Supply Voltage

-0.3

6.0

V

Input Voltage

V

1)

Power Dissipation

20

mW

Storage Temperature

-55

150

Note: Not valid for programming pin PV

RECOMMENDED OPERATION CONDITIONS

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Supply Voltage

2.7

2.8

5.5

V

Supply Current

Vcc = 2.8 Volt

1.8

mA

Operable Temperature

-30

+85

Storage Temperature

Relative humidity =

15%…70%

-5

+40

Crystal Pulling Sensitivity

S

30

ppm/pF

Load Capacitance

10

pF