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SST13LP02-QDF 数据表(PDF) 1 Page - Silicon Storage Technology, Inc |
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SST13LP02-QDF 数据表(HTML) 1 Page - Silicon Storage Technology, Inc |
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1 / 25 page ![]() ©2006 SST Communications Corp. S71304-01-000 9/06 1 The SST logo and SuperFlash are registered Trademarks of Silicon Storage Technology, Inc. These specifications are subject to change without notice. Preliminary Specifications Features: • High Gain: – Typically 27-28 dB gain across 2.4-2.5 GHz – Typically 30-34 dB gain across 4.9-5.8 GHz • High linear output power: – >25 dBm P1dB (Pulsed single-tone signal) across 2.4-2.5 GHz – Meets 802.11b OFDM ACPR requirement up to 21.5 dBm across 2.4-2.5 GHz – Meets 802.11g OFDM ACPR requirement up to 22 dBm across 2.4-2.5 GHz – Added EVM~4% up to 19 dBm for 54 Mbps 802.11g signal across 2.4-2.5 GHz – >25 dBm P1dB (Pulsed single-tone signal) across 4.9-5.8 GHz – Meets 802.11a OFDM ACPR requirement up to 22 dBm across 4.9-5.8GHz – Added EVM~4% up to 18 dBm for 54 Mbps 802.11a signal across 4.9-5.8GHz • High power-added efficiency/Low operating current for 802.11a/b/g applications – ~220 mA @ POUT = 22 dBm for 802.11g – ~205 mA @ POUT = 21.5 dBm for 802.11b – ~380 mA @ POUT = 22 dBm for 802.11a • Built-in Ultra-low IREF power-up/down control –IREF <2 mA • Low idle current –~55 mA ICQ (802.11b/g) – ~135 mA ICQ (802.11a) • High-speed power-up/down – Turn on/off time (10%-90%) <100 ns – Typical power-up/down delay with driver delay included <200 ns • High temperature stability – ~2/1 dB gain/power variation between 0°C to +85°C across 2.4-2.5 GHz – ~8/2 dB gain/max linear power variation between 0°C to +85°C across 4.9-5.8 GHz – ~1 dB detector variation over 0°C to +85°C • Low shut-down current (< 0.1 µA) • On-chip power detection • 20 dB dynamic range on-chip power detection • Simple input/output matching • Packages available – 24-lead WQFN (4mm x 4mm) – Non-Pb (lead-free) packages available Applications: • WLAN (IEEE 802.11a/g/b) • Japanese WLAN • HyperLAN2 • Multimedia •Home RF • Cordless phones Product Description The SST13LP02 is a high-efficiency, dual-band power amplifier based on the highly-reliable InGaP/GaAs HBT technology. The SST13LP02 can be easily configured for high-power applications with superb power-added efficiency while operating over the 802.11a/b/g frequency band for U.S., European, and Japanese markets (2.4-2.5 GHz and 4.9- 5.8 GHz). The SST13LP02 has excellent linearity, typically ~4% added EVM at 19 dBm output power, which is essential for 54 Mbps 802.11g operation while meeting 802.11g spec- trum mask at 22 dBm and 802.11b spectrum mask at 21.5 dBm. For 802.11a operation, the SST13LP02 has demon- strated typically ~4% added EVM at 18 dBm output power while meeting 802.11a spectrum mask at 22 dBm. The SST13LP02 also has wide-range (>15 dB), temperature- stable (~1.5 dB over 85°C), single-ended power detectors which lower users’ cost on power control. The power amplifier IC also features easy board-level usage along with high-speed power-up/down control. Ultra-low reference current (total IREF <2 mA) makes the SST13LP02 controllable by an on/off switching signal directly from the baseband chip. These features, coupled with low operating current, make the SST13LP02 ideal for the final stage power amplification in both battery- powered 802.11a/b/g WLAN transmitters and access point applications. The SST13LP02 is offered in a 24-contact WQFN package. See Figure 2 for pin assignments and Table 1 for pin descriptions. 2.4-2.5 GHz / 4.9-5.8 GHz Dual-Band Power Amplifier SST13LP02 SST13LP022.4 - 2.5 GHz / 4.9-5.8 GHz Dual-Band Power Amplifier |
类似零件编号 - SST13LP02-QDF |
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类似说明 - SST13LP02-QDF |
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