DA9276.003

13 July, 2006

2 (8)

PIN DESCRIPTION

Pin Description

Symbol

x-coordinate

y-coordinate

Power Supply Voltage

VDD

166

1430

Programming Input

PV

420

1435

Serial Bus Clock Input

CLK

979

1441

Serial Bus Data Input

DA

1234

1441

Temperature Output

TE1

1488

1441

Test Multiplexer Output

TE2

1742

1441

Voltage Control Input

VC

185

153

Crystal Oscillator Output

X1

439

149

Crystal/Varactor Oscillator Input

X2

1357

149

Power Supply Ground

VSS

1790

166

Buffer Output

OUT

2046

153

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component

assembly are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

ABSOLUTE MAXIMUM RATINGS

(test conditions)

Parameter

Symbol

Min

Max

Unit

Note

Supply Voltage

-0.3

6.0

V

Input Voltage

V

1)

Power Dissipation

20

mW

Storage Temperature

-55

150

Note 1: Not valid for programming pin PV

RECOMMENDED OPERATION CONDITIONS

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Note

Supply Voltage

2.7

2.8

5.5

V

Supply Current

Vdd = 2.8 Volt

1.8

mA

Operating Temperature

-30

+85

Storage Temperature

Relative humidity =

15%…70%

-5

+40

Crystal Pulling Sensitivity

S

30

ppm/pF

Crystal Load Capacitance

10

pF