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MAS9281 数据表(PDF) 3 Page - Micro Analog systems

部件名 MAS9281
功能描述  IC FOR 10.00 - 60.00 MHz XO
PDF  6 Pages
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制造商  MAS [Micro Analog systems]
网页  http://www.mas-oy.com
标志 MAS - Micro Analog systems

MAS9281 数据表(HTML) 3 Page - Micro Analog systems

  MAS9281 Datasheet HTML 1Page - Micro Analog systems MAS9281 Datasheet HTML 2Page - Micro Analog systems MAS9281 Datasheet HTML 3Page - Micro Analog systems MAS9281 Datasheet HTML 4Page - Micro Analog systems MAS9281 Datasheet HTML 5Page - Micro Analog systems MAS9281 Datasheet HTML 6Page - Micro Analog systems  
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DA9281.002
10 July 2006
ELECTRICAL CHARACTERISTICS FOR 5V SUPPLY VOLTAGE
TA = -40°C to +85°C, typical values at TA = +27°C, VDD = 4.5V… 5V, fO = 30 MHz, Output Load = 15 pF, unless otherwise specified.
Parameter
Symbol
Min
Typ
Max
Unit
Note
Output Load
15
50
pF
Crystal Frequency Range
when Output Load is Maximum 30pF
fo
10.00
60.00
MHz
Note 1
Crystal Frequency Range
when Output Load is Maximum 50pF
fo
10.00
40.00
MHz
Supply Current
MAS9281 (fo)
MAS9281 (fo/2)
MAS9281 (fo/4)
MAS9281 (fo/8)
MAS9281 (fo/16)
MAS9281 (fo/512)
IDD
11.3
8.0
7.7
7.6
7.3
7.1
mA
See fig. 2
Output Voltage Range
Vdd ± 0.5
Vpp
Rise and Fall Time
3
4
ns
Start-up Time
TSTART
2
ms
Output Symmetry
45
48-52
55
%
Tri State Output Buffer
OFF State
ON State
PD
0
1.6
0.55
VDD
V
Power Down High Level Output
Voltage: Ioh=16 mA ,Vdd = 5V
(Test measurement, see fig. 1, p. 5)
VOH
4.7
V
PD Pull-up resistance
Design value
Rup1
900k
ohm
Note1: MAS9281AN – MAS9281AT and MAS9281A0 – MAS9281A4 maximum frequency is 44MHz
PIN DESCRIPTION
Pin Description
Symbol
x-coordinate
y-coordinate
Power Down
PD
146
140
Crystal Oscillator Output
X2
312
140
Crystal Oscillator Input
X1
553
140
Power Supply Ground
VSS
695
140
Power Supply Voltage
VDD
178
826
Buffer Output
OUT
597
826
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.



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