DA9283.006

13 July 2006

2 (14)

PIN DESCRIPTION

Pin Description

Symbol

x-coordinate

y-coordinate

Crystal Oscillator Output

X2

186

142

Voltage Control Input

VC

372

142

Power Supply Ground

543

142

Crystal/Varactor Oscillator Input

X1

149

920

Output Buffer Power Down Control

PD

330

920

Power Supply Voltage

500

920

Buffer Output

OUT

919

920

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component

assembly are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location. However, the distances between pads are

accurate.

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Conditions

Min

Max

Unit

Note

Supply Voltage

-0.3

5.5

V

Input Pin Voltage

V

Power Dissipation (max)

100

mW

Storage Temperature

-55

150

ESD Rating

HBM

2

kV

RECOMMENDED OPERATION CONDITIONS

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Note

Supply Voltage

For 3.3 V / 5.0 V

versions

For 3.3 V versions

2.5

2.5

3.3

3.3

5.3

4.0

V

1)

1, 2)

Supply Current

3.2

mA

3)

Operating Temperature

-40

+85

Voltage Control Line

Impedance

1

M

Crystal Pulling Sensitivity

S

30

ppm/pF

Crystal Load Capacitance

10

pF

4)

Note 2: For 3.3 V versions MAS9283AA-AE, MAS9283AN-AR.