7.7 Thermal Information for LM339B and LM2901B

THERMAL METRIC(1)

LM339B, LM2901B

UNIT

D

(SOIC)

PW

(TSSOP)

DDY

(SOT-23)

RUC

(QFN)

RTE

(QFN)

14 PINS

14 PINS

14 PINS

14 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

111.2

136.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

66.9

66.6

°C/W

RθJB

Junction-to-board thermal resistance

67.8

79.8

°C/W

ψJT

Junction-to-top characterization parameter

28.0

17.8

°C/W

ψJB

Junction-to-board characterization parameter

67.4

79.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

-

-

-

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics report,

SPRA953.

7.8 Thermal Information for Non-B Versions

THERMAL METRIC(1)

LMx39, LM2901x

UNIT

D

(SOIC)

DB

(SSOP)

N

(PDIP)

NS

(SO)

PW

(TSSOP)

J

(CDIP)

W

(CFP)

RθJA

Junction-to-ambient thermal resistance

98.8

111.8

79

96.2

120

89.5

156.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

64.3

63.6

73.4

56.1

59

46.1

86.7

°C/W

RθJB

Junction-to-board thermal resistance

59.7

60.5

58.7

56.9

68.8

78.7

154.6

°C/W

ψJT

Junction-to-top characterization parameter

25.7

26.2

48.3

24.8

9.9

3

56.5

°C/W

ψJB

Junction-to-board characterization

parameter

59.3

59.8

58.5

56.4

68.2

71.8

133.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

—

—

—

—

—

24.2

14.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

LM139, LM239, LM339, LM339B, LM139A, LM239A

LM339A, LM2901B, LM2901, LM2901AV, LM2901V

SLCS006V – OCTOBER 1979 – REVISED DECEMBER 2022

www.ti.com

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