CS9202

http://onsemi.com

2

MAXIMUM RATINGS

Parameter

Value

Unit

Power Dissipation

Internally Limited

−

DC

−15 to 36

74

V

V

Output Current

Internally Limited

−

ESD Susceptibility (Human Body Model)

4.0

kV

Package Thermal Resistance:

25

110

°C/W

°C/W

Junction Temperature

−40 to +150

°C

Storage Temperature

−55 to +150

°C

Lead Temperature Soldering: Reflow (SMD styles only) (Note 1)

230 Peak

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. 60 second maximum above 183

°C.

Parameter

Test Conditions

Min

Typ

Max

Unit

OUTPUT STAGE

3.234

3.201

3.300

3.300

3.366

3.399

V

V

Load Regulation

−

5

50

mV

Line Regulation

−

5

50

mV

−

450

4

12

750

6

20

mA

mA

mA

Ripple Rejection

7.0 V

60

75

−

dB

Current Limit

−

105

200

−

mA

Short Circuit Output Current

25

125

−

mA

Thermal Shutdown (Note 2)

−

150

180

−

°C

Overvoltage Shutdown

28

32

36

V

2. This parameter is guaranteed by design, but not parametrically tested in production.

PACKAGE LEAD DESCRIPTION

Package Lead Number

SOIC−8

Lead Symbol

Function

1

3.3 V,

± 2%, 100 mA output.

2, 3, 6, 7

GND

Ground.

4, 5

NC

No connection.

8

Input voltage.