74FST6800

http://onsemi.com

2

Figure 2. Logic Diagram

1

11

2

OE

23

14

13

Bias V

ORDERING INFORMATION

Device Order Number

Package

74FST6800DW

SOIC−24

48 Units / Rail

74FST6800DWR2

SOIC−24

2500 Units / Tape & Reel

74FST6800DT

TSSOP−24*

(Pb−Free)

96 Units / Rail

74FST6800DTR2

TSSOP−24*

(Pb−Free)

2500 Units / Tape & Reel

74FST6800QS

QSOP−24

96 Units / Rail

74FST6800QSR

QSOP−24

2500 Units / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*This package is inherently Pb−Free.

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage

*0.5 to )7.0

V

DC Input Voltage

*0.5 to )7.0

V

DC Output Voltage

*0.5 to )7.0

V

DC Input Diode Current

*50

mA

DC Output Diode Current

*50

mA

DC Output Sink Current

128

mA

DC Supply Current per Supply Pin

$100

mA

DC Ground Current per Ground Pin

$100

mA

Storage Temperature Range

*65 to )150

°C

Lead Temperature, 1 mm from Case for 10 Seconds

260

°C

Junction Temperature Under Bias

)150

°C

Thermal Resistance

SOIC

TSSOP

QSOP

125

170

200

°C/W

MSL

Moisture Sensitivity

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

ESD Withstand Voltage

Human Body Model (Note 1)

Machine Model (Note 2)

Charged Device Model (Note 3)

u2000

u200

N/A

V

Latchup Performance

$500

mA

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Tested to EIA/JESD22−A114−A.

2. Tested to EIA/JESD22−A115−A.

3. Tested to JESD22−C101−A.

4. Tested to EIA/JESD78.