7.6 Thermal Information

THERMAL METRIC(1)

TMUX821x

TMUX821x

UNIT

PW (TSSOP)

RUM (WQFN)

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

96.0

41.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

26.8

25.3

°C/W

RθJB

Junction-to-board thermal resistance

42.7

16.0

°C/W

ΨJT

Junction-to-top characterization parameter

1.2

0.3

°C/W

ΨJB

Junction-to-board characterization parameter

42.0

16.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

3.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.7 Electrical Characteristics (Global): TMUX821x Devices

over operating free-air temperature range (unless otherwise noted)

typical at VDD = +36 V, VSS = –36 V, GND = 0 V and TA = 25℃ (unless otherwise noted)

PARAMETER

TEST CONDITIONS

TA

MIN

TYP

MAX

UNIT

LOGIC INPUTS

VIH

Logic voltage high

–40°C to +125°C

1.3

48

V

VIL

Logic voltage low

–40°C to +125°C

0

0.8

V

IIH

Input leakage current

Logic inputs = 0 V, 5 V, or 48 V

–40°C to +125°C

0.4

3.8

µA

IIL

Input leakage current

Logic inputs = 0 V, 5 V, or 48 V

–40°C to +125°C

–0.2 –0.005

µA

CIN

Logic input capacitance

–40°C to +125°C

3

pF

POWER SUPPLY

IDD

VDD supply current

Logic inputs = 0 V, 5 V, or 48 V

25°C

350

800

µA

–40°C to +85°C

800

µA

–40°C to +125°C

900

µA

ISS

VSS supply current

Logic inputs = 0 V, 5 V, or 48 V

25°C

350

800

µA

–40°C to +85°C

800

µA

–40°C to +125°C

900

µA

TMUX8211, TMUX8212, TMUX8213

SCDS434B – OCTOBER 2021 – REVISED MARCH 2023

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