ZLED7x30 Datasheet

6

April 20, 2016

1.3

Electrical Parameters

Except as noted, test conditions for the following specifications are Tamb = 25°C typical and VIN = 12V unless

otherwise noted.

Production testing of the chip is performed at 25°C unless otherwise stated. Functional operation of the chip and

specified parameters at other temperatures are guaranteed by design, characterization, and process control.

No.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNIT

1.3.1

Quiescent supply current

IINQoff

Output off

70

120

140

μA

IINQon

Output switching

450

600

μA

1.3.2

Mean current sense

threshold voltage

VSENSE

95

100

105

mV

1.3.3

Sense threshold hysteresis

VSENSEHYS

±15

%

1.3.4

ISENSE pin input current

ISENSE

VSENSE = VIN -0.1V

8

μA

1.3.5

Under-voltage lockout

threshold

VUVLO

VIN rising

5.05

5.85

6.65

V

1.3.6

Under-voltage lockout

hysteresis

∆V

UVLO

1.65

V

1.3.7

Ratio of output current

level to initial current in

Dimming Mode 1

K1

DIM1: Floating

DIM2: GND

Level 1

100

%

Level 2

50

%

Level 3

17

20

23

%

1.3.8

Ratio of output current

level to initial current in

Dimming Mode 2

K2

DIM1: GND

DIM2: Floating

Level 1

100

%

Level 2

60

%

Level 3

28

30

32

%

1.3.9

Ratio of output current

level to initial current in

Dimming Mode 3

K3

DIM1: GND

DIM2: GND

Level 1

100

%

Level 2

28

30

32

%

1.3.10

Interval time between

external switch actions

TS

2

s

1.3.11

LX switch continuous

current

ILXmean_0

ZLED7030

1.2

A

ILXmean_3

ZLED7330

1.0

A

ILXmean_5

ZLED7530

0.75

A

ILXmean_7

ZLED7730

0.35

A

1.3.12

LX switch leakage current

ILX(leak)

1

μA

1.3.13

LX switch on resistance

RLX

0.3

0.4

Ω

1.3.14

Minimum switch on time

tONmin

LX switch on

200

ns

1.3.15

Minimum switch off time

tOFFmin

LX switch off

200

ns

1.3.16

Recommended operating

frequency maximum

fLXmax

1

MHz