TDA7529 datasheet(58/60 Pages) STMICROELECTRONICS

58 / 60 page

Package information

TDA7529

58/60

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 18.

LQFP64 (10x10x1.4mm) exposed pad down mechanical data and package

dimensions (exposed pad size for D2 and E2: 4.5mm max.)

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

0.050

0.150 0.0020

0.0059

1.350

1.400

1.450 0.0531 0.0551 0.0571

0.170

0.220

0.270 0.0067 0.0087 0.0106

0.090

0.200 0.0035

0.0079

11.800 12.000 12.200 0.4646 0.4724 0.4803

9.800 10.000 10.200 0.3858 0.3937 0.4016

According to Pad size

7.500

0.2953

11.800 12.000 12.200 0.4646 0.4724 0.4803

9.800 10.000 10.200 0.3858 0.3937 0.4016

According to Pad size

7.500

0.2953

0.500

0.0197

0.450

0.600

0.750 0.0177 0.0236 0.0295

1.000

0.0394

3.500

7.000

0.1378 0.2756

ccc

0.080

0.0031

Note: 1. Exact shape of each corner is optional.

LQFP64 (10x10x1.4mm)

Exposed Pad Down

7278841 C

TDA7529 数据表(PDF) 58 Page - STMicroelectronics

TDA7529 数据表(HTML) 58 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60

数据表下载