NCP500

http://onsemi.com

19

PACKAGE DIMENSIONS

DFN6 2x2.2 mm

SQL SUFFIX

CASE 488−03

ISSUE G

0.50

0.020

SCALE 10:1

0.40

0.016

1.9

0.075

0.65

0.025

0.65

0.025

0.50

0.020

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. TERMINAL b MAY HAVE MOLD COMPOUND

MATERIAL ALONG SIDE EDGE.

6. DETAILS A AND B SHOW OPTIONAL VIEWS

FOR END OF TERMINAL LEAD AT EDGE OF

PACKAGE AND SIDE EDGE OF PACKAGE.

C

A

SEATING

PLANE

D

B

E

0.10 C

A3

A

A1

2X

2X

0.10 C

DIM

A

MIN

NOM

MILLIMETERS

0.80

0.90

A1

0.00

0.03

A3

0.20 REF

b

0.20

0.25

D

2.00 BSC

D2

0.40

0.50

0.30

0.35

E

2.20 BSC

b1

e

0.65 BSC

0.30

0.35

L

PIN ONE

REFERENCE

0.08 C

0.10 C

6X

A

0.10 C

NOTE 3

e

b1

D2

b

B

3

6

5X

1

L

4

6X

0.05 C

BOTTOM VIEW

MAX

1.00

0.05

0.30

0.60

0.40

0.40

SIDE VIEW

TOP VIEW

A

0.10 C

NOTE 3

B

0.05 C

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DETAIL B

DETAIL A

L1

DETAIL A

Bottom View

(Optional)

A1

A3

DETAIL B

Side View

(Optional)

EDGE OF PACKAGE

MOLD CMPD

EXPOSED Cu

0.00

0.05

L1

0.10