ADA4851-1/ADA4851-2/ADA4851-4

Rev. D | Page 17 of 20

4.50

4.40

4.30

14

8

7

1

6.40

BSC

PIN 1

5.10

5.00

4.90

0.65

BSC

SEATING

PLANE

0.15

0.05

0.30

0.19

1.20

MAX

1.05

1.00

0.80

0.20

0.09

8°

0°

0.75

0.60

0.45

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB-1

Figure 50. 14-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-14)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

ADA4851-1YRJZ-R21

−40°C to +125°C

6-Lead Small Outline Transistor Package (SOT-23)

RJ-6

HHB

ADA4851-1YRJZ-RL1

−40°C to +125°C

6-Lead Small Outline Transistor Package (SOT-23)

RJ-6

HHB

ADA4851-1YRJZ-RL71

−40°C to +125°C

6-Lead Small Outline Transistor Package (SOT-23)

RJ-6

HHB

ADA4851-2YRMZ1

−40°C to +125°C

8-Lead Mini Small Outline Package (MSOP)

RM-8

HSB

ADA4851-2YRMZ-RL1

−40°C to +125°C

8-Lead Mini Small Outline Package (MSOP)

RM-8

HSB

ADA4851-2YRMZ-RL71

−40°C to +125°C

8-Lead Mini Small Outline Package (MSOP)

RM-8

HSB

ADA4851-4YRUZ1

–40°C to +125°C

14-Lead Thin Shrink Small Outline Package (TSSOP)

RU-14

ADA4851-4YRUZ-RL1

–40°C to +125°C

14-Lead Thin Shrink Small Outline Package (TSSOP)

RU-14

ADA4851-4YRUZ-R71

–40°C to +125°C

14-Lead Thin Shrink Small Outline Package (TSSOP)

RU-14