ADCMP572/ADCMP573

Rev. 0 | Page 14 of 16

OUTLINE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION

1

0.50

BSC

0.60 MAX

PIN 1 INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

3.00

BSC SQ

1.65

1.50 SQ*

1.35

16

5

13

8

9

12

4

EXPOSED

PAD

(BOTTOM VIEW)

Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 x 3 mm Body

(CP-16-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADCMP572BCP-WP

−40°C to 85°C

LFCSP-16

CP-16-3

ADCMP572BCP-R2

−40°C to 85°C

LFCSP-16

CP-16-3

ADCMP572BCP-RL7

−40°C to 85°C

LFCSP-16

CP-16-3

EVAL-ADCMP572BCP

Evaluation Board

ADCMP573BCP-WP

−40°C to 85°C

LFCSP-16

CP-16-3

ADCMP573BCP-R2

−40°C to 85°C

LFCSP-16

CP-16-3

ADCMP573BCP-RL7

−40°C to 85°C

LFCSP-16

CP-16-3

EVAL-ADCMP573BCP

Evaluation Board