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56F803 数据表(PDF) 49 Page - Freescale Semiconductor, Inc |
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56F803 数据表(HTML) 49 Page - Freescale Semiconductor, Inc |
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49 / 57 page ![]() 56F803 Technical Data, Rev. 16 44 Freescale Semiconductor 1. Parasitic capacitance due to package, pin to pin, and pin to package base coupling. (1.8pf) 2. Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing. (2.04pf) 3. Equivalent resistance for the ESD isolation resistor and the channel select mux. (500 ohms) 4. Sampling capacitor at the sample and hold circuit. (1pf) Figure 3-26 Equivalent Analog Input Circuit 3.13 Controller Area Network (CAN) Timing ADC Quiescent Current (both ADCs) IADC —50 — mA VREF Quiescent Current (both ADCs) IVREF —12 16.5 mA 1. For optimum ADC performance, keep the minimum VADCIN value > 25mV. Inputs less than 25mV may convert to a digital output code of 0. 2. VREF must be equal to or less than VDDA and must be greater than 2.7V. For optimal ADC performance, set VREF to VD- DA-0.3V. 3. Measured in 10-90% range. 4. LSB = Least Significant Bit. 5. Guaranteed by characterization. 6. tAIC = 1/fADIC Table 3-17 CAN Timing2 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40× to +85×C, CL £ 50pF, MSCAN Clock = 30MHz Characteristic Symbol Min Max Unit Baud Rate BRCAN —1 Mbps Bus Wakeup detection 1 T WAKEUP 5— μs Table 3-16 ADC Characteristics Characteristic Symbol Min Typ Max Unit 1 2 3 4 ADC analog input |
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