6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Supply voltage range

VCC

–0.3

7

V

Voltage range USB data

DxP, DxM

–0.3

5.5

V

Voltage range on EQ pin

EQ

-0.3

1.98

V

Voltage range other pins

RSTN

-0.3

5.5

V

Storage temperature, Tstg

–65

150

°C

Maximum junction temperature, TJ (max)

125

°C

(1)

Operation outside the Absolute Maximum Rating may cause permanent device damage. Absolute Maximum Rating do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Condition. If

used outside the Recommended Operating Condition but within the Absolute Maximum Rating, the device may not be fully functional,

and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(2)

±2000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(3)

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

2.3

5

6.5

V

TA

Operating free-air temperature (TUSB211A)

0

70

°C

Operating free-air temperature (TUSB211AI)

–40

85

°C

TJ

Junction temperature (TUSB211A)

85

°C

Junction temperature (TUSB211AI)

105

°C

DxP, DxM

Voltage range USB data

0

3.6

V

EQ

Voltage range EQ pin

0

1.98

V

DIGITAL

Voltage range other pins (RSTN)

0

3.6

V

6.4 Thermal Information

THERMAL METRIC (1)

RWB (X2QFN)

UNIT

12 PINS

RθJA

Junction-to-ambient thermal resistance

137.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

62

°C/W

RθJB

Junction-to-board thermal resistance

67.2

°C/W

ψJT

Junction-to-top characterization parameter

1.9

°C/W

ψJB

Junction-to-board characterization parameter

67.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TUSB211A

SLLSFW2 – SEPTEMBER 2023

www.ti.com

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