PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

5962-7802301M2A

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

5962-7802301MEA

ACTIVE

CDIP

J

16

1

TBD

A42 SNPB

N / A for Pkg Type

5962-7802301MFA

ACTIVE

CFP

W

16

1

TBD

A42 SNPB

N / A for Pkg Type

AM26LS31CD

ACTIVE

SOIC

D

16

40

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

AM26LS31CDBR

ACTIVE

SSOP

DB

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

AM26LS31CDBRE4

ACTIVE

SSOP

DB

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

AM26LS31CDE4

ACTIVE

SOIC

D

16

40

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

AM26LS31CDR

ACTIVE

SOIC

D

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

AM26LS31CDRE4

ACTIVE

SOIC

D

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

AM26LS31CN

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

AM26LS31CNE4

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

AM26LS31CNSR

ACTIVE

SO

NS

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

AM26LS31CNSRG4

ACTIVE

SO

NS

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

AM26LS31MFKB

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

AM26LS31MJB

ACTIVE

CDIP

J

16

1

TBD

A42 SNPB

N / A for Pkg Type

AM26LS31MWB

ACTIVE

CFP

W

16

1

TBD

A42 SNPB

N / A for Pkg Type

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

PACKAGE OPTION ADDENDUM

www.ti.com

7-Aug-2006

Addendum-Page 1