2

FN1547.7

March 17, 2006

Ordering Information

PART NUMBER

PART MARKING

TEMP

RANGE

(°C)

PACKAGE

PKG

DWG. #

CDP68HC68T1E

CDP68HC68T1E

-40 to 85 16 Ld PDIP

E16.3

CDP68HC68T1EZ

(Note)

CDP68HC68T1EZ -40 to 85 16 Ld PDIP**

(Pb-free)

E16.3

CDP68HC68T1M*

68HC68T1M

-40 to 85 20 Ld SOIC M20.3

CDP68HC68T1MZ*

(Note)

68HC68T1MZ

-40 to 85 20 Ld SOIC

(Pb-free)

M20.3

CDP68HC68T1M2*

HC68T1M2

-40 to 85 16 Ld SOIC M16.3

CDP68HC68T1M2Z*

(Note)

HC68T1M2Z

-40 to 85 16 Ld SOIC

(Pb-free)

M16.3

*Add “96” suffix for taoe and reel.

**Pb-free PDIPs can be used for through hole wave solder processing only.

They are not intended for use in Reflow solder processing. applications.

Pin number references throughout this specification refer to the 16 lead

PDIP/SOIC. See pinouts for cross reference.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material

sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb

and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the

Pb-free requirements of IPC/JEDEC J STD-020.