Aluminum Electrolytic Capacitors

VFZ Series: Low Impedence, Long Life

Page 5 of 5

RFE International • Tel (949) 833-1988 • Fax (949) 833-1788 • E-mail sales@rfeinc.com

17.05.2022

REFLOW SOLDERING CONDITION

1. Thermal condition system such as infrared radiation (IR) or hot blast should be used,

vapor phase (VPS) is not recommended.

2. The maximum cycle of reflow soldering is two times. The second cycle must be done

after sufficient cooling time for more than one hour to return the temperatures of

circuit boards and componenets back to room temperature

3. For lead-free type reflow soldering, please observe proper conditions below:

Preheat : 150°C to 180°C within 120 seconds

Voltage (V)

Diameter

200

˚C T Max

217

˚C T1 Max 230 ˚C T2 Max

TP5S Max

4 to 6.3

≤ 70 sec.

≤ 60 sec.

≤ 40 sec.

250

˚C

8

≤ 60 sec.

≤ 50 sec.

≤ 30 sec.

245

˚C

10, 12.5

≤ 50 sec.

≤ 40 sec.

≤ 20 sec.

240

˚C

16, 18

≤ 50 sec.

≤ 30 sec.

≤ 15 sec.

235

˚C

4 to 6.3

≤ 60 sec.

≤ 50 sec.

≤ 40 sec.

250

˚C

8

≤ 60 sec.

≤ 40 sec.

≤ 30 sec.

240

˚C

10

≤ 50 sec.

≤ 30 sec.

≤ 20 sec.

240

˚C

12.5

≤ 50 sec.

≤ 30 sec.

≤ 20 sec.

235

˚C

16, 18

≤ 45 sec.

≤ 20 sec.

≤ 10 sec.

235

˚C

4 to 63

80 to 100

• These devices do not intentionally contain any restricted substances listed in RoHS directive (Cd, Pb, Hg, Cr(VI),

PBB, PBDE, DEHP.

• Our products are “articals without any intended release” and are not applicable for registration for REACH article 7.