● Low profile package

● Ideal for automated placement

● Glass passivated chip junction

● High forward surge capability

● Meets MSL level 1, per J-STD-020, LF maximum peak

of 260 °C

For use in general purpose rectification of power

supplies, inverters, converters, and freewheeling diodes for

consumer, and telecommunication.

● Package: SMAF

Molding compound meets UL 94 V-0 flammability

rating, RoHS-compliant, halogen-free

● Terminals: Tin plated leads, solderable per

J-STD-002 and JESD22-B102

● Polarity: Cathode line denotes the cathode end

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(Ta=25 Unless otherwise specified）

PARAMETER

SYMBOL UNIT

G2AF

G2BF

G2DF

G2GF

G2JF

G2KF

G2MF

Device marking code

G2AF

G2BF

G2DF

G2GF

G2JF

G2KF

G2MF

Repetitive peak reverse voltage

VRRM

V

50

100

200

400

600

800

1000

Average rectified output current

@60Hz sine wave, resistance load, TL (Fig.1)

IO

A

2.0

Surge(non-repetitive)forward current

@60Hz half-sine wave,1 cycle, Ta=25

°C

IFSM

A

50

Storage temperature

Tstg

°C

-55~+150

Junction temperature

Tj

-55~+150

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（Ta=25°C Unless otherwise specified）

PARAMETER

SYMBOL

UNIT

TEST

CONDITIONS

G2AF

G2BF

G2DF

G2GF

G2JF

G2KF

G2MF

Maximum instantaneous

forward voltage drop per diode

VF

V

IFM=2.0A

1.1

Maximum DC reverse current

at rated DC blocking voltage

per diode @ VRM=VRRM

IRRM

μA

Ta=25°C

5.0

Ta=125°C

100

°C

°C

Surface Mount Tension Resolution

G2AF Through G2MF

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■

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FEATURES

TYPICAL APPLICATIONS

MECHANICAL DATA

MAXIMUM RATINGS

TYPICAL CHARACTERISTICS

S-S038

07-14-2020

Page 1 of 3

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（Ta=25°C Unless otherwise specified）

PARAMETER

SYMBOL

UNIT

G2AF

G2BF

G2DF

G2GF

G2JF

G2KF

G2MF

Thermal resistance

RθJ-A(1)

°C/W

651)

RθJ-L(1)

251)

THERMAL CHARACTERISTICS

Note:

(1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas