FEATURES

● Low profile package

● Ideal for automated placement

● Glass passivated chip junction

● High forward surge capability

● Meets MSL level 1, per J-STD-020, LF maximum peak

of 260 °C

TYPICALAPPLICATIONS

For use in general purpose rectification of power

supplies, inverters, converters, and freewheeling diodes for

consumer, and telecommunication.

MECHANICAL DATA

● Package: DO-214AA (SMB)

Molding compound meets UL 94 V-0 flammability

rating, RoHS-compliant, halogen-free

● Terminals: Tin plated leads, solderable per

J-STD-002 and JESD22-B102

● Polarity: Cathode line denotes the cathode end

■ MAXIMUM RATINGS (Ta=25 Unless otherwise specified）

PARAMETER

SYMBOL

UNIT

GS3AB

GS3BB GS3DB GS3GB GS3JB

GS3KB GS3MB

Device marking code

GS3AB

GS3BB

GS3DB

GS3GB

GS3JB

GS3KB

GS3MB

Repetitive peak reverse voltage

VRRM

V

50

100

200

400

600

800

1000

Average rectified output current

@60Hz sine wave, resistance load, TL (Fig.1)

IO

A

3.0

Surge(non-repetitive)forward current

@60Hz half-sine wave,1 cycle, Ta=25

°C

IFSM

A

100

Storage temperature

Tstg

°C

-55~+150

Junction temperature

Tj

°C

-55~+150

■ ELECTRICAL CHARACTERISTICS（Ta=25 Unless otherwise specified）

PARAMETER

SYMBOL UNIT

TEST

CONDITIONS

GS3AB GS3BB GS3DB GS3GB GS3JB GS3KB GS3MB

Maximum instantaneous

forward voltage drop per diode

VF

V

IFM=3.0A

1.15

Maximum DC reverse current

at rated DC blocking voltage

per diode @ VRM=VRRM

IRRM

μA

Ta=25

5

Ta=125°C

100

°C

°C

°C

Surface Mount General Purpose Rectifier

GS3AB Through GS3MB

(SMB)

■

■

■

S-S055

07-17-2020

■THERMAL CHARACTERISTICS（Ta=25°C Unless otherwise specified）

PARAMETER

SYMBOL

UNIT

GS3AB

GS3BB

GS3DB

GS3GB

GS3JB

GS3KB

GS3MB

Thermal resistance

RθJ-A

°C/W

751)

RθJ-L

201)

:

Page 1 of 3

Note

(1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x5.0 mm) copper pad areas

RFE International • Tel (949) 833-1988 • Fax (949) 833-1788 • E-mail sales@rfeinc.com