1°C Dual SMBus Sensor with Resistance Error Correction

Datasheet

SMSC EMC1002

21

Revision 1.3 (03-24-06)

DATASHEET

Chapter 6 Package Outlines

Figure 6.1 8-Pin MSOP and 8-Pin MSOP (Lead-Free) Package Outline - 3x3mm Body 0.65mm Pitch

Notes:

1. Controlling Unit: millimeters.

2. Tolerance on the true position of the leads is ± 0.065 mm maximum.

3. Package body dimensions D and E1 do not include mold protrusion or flash. Dimensions D and

E1 to be determined at datum plane H. Maximum mold protrusion or flash is 0.15mm (0.006 inches)

per end, and 0.15mm (0.006 inches) per side.

4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5. Details of pin 1 identifier are optional but must be located within the zone indicated.

Table 6.1 8-Pin MSOP and 8-Pin MSOP (Lead-Free) Package Parameters

MIN

NOMINAL

MAX

REMARKS

A

0.80

~

1.10

Overall Package Height

A1

0.05

~

0.15

Standoff

A2

0.75

0.85

0.95

Body Thickness

D

2.80

3.00

3.20

X Body Size

E

4.65

4.90

5.15

Y Span

E1

2.80

~

3.20

Y body Size

H

0.08

~

0.23

Lead Foot Thickness

L

0.40

~

0.80

Lead Foot Length

L1

0.95 REF

Lead Length

e

0.65 BSC

Lead Pitch

θ

Lead Foot Angle

W

0.22

~

0.38

Lead Width

ccc

~

~

0.10

Coplanarity