3

3 - 208

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Pad Number

Function

Description

Interface Schematic

1VddRF

Power supply for RF LNA.

External RF bypass capacitors are required.

2VddLO2

Power supply for second stage of LO amplifier.

External RF bypass capacitors are required.

3VddLO

Power supply for first stage of LO amplifier.

External RF bypass capacitors are required.

4LO

This pad is AC coupled and matched

to 50 Ohms from 7 - 12 GHz.

5IF1

This pad is DC coupled for applications not requir-

ing operation to DC. This port should be DC blocked

externally using a series capacitor whose value has

been chosen to pass the necessary frequency range.

For operation to DC, this pad must not source /sink more

than 3 mA of current or die non - function and possible

die failure will result.

6IF2

7RF

This pad is AC coupled and matched

to 50 Ohms from 17 - 21 GHz.

GND

The backside of the die must be

connected to RF/DC ground.

Pad Descriptions

v00.0606

Typical Application

HMC570

GaAs MMIC I/Q DOWNCONVERTER

17 - 21 GHz